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一种以硅藻土为原料低温烧制多孔方石英的方法 专利
专利号: ZL201410021134.1, 申请日期: 2014-01-16, 公开日期: 2014-05-07
Authors:  袁巍巍;  刘冬;  谭道永;  于文彬;  袁鹏
Favorite  |  View/Download:142/0  |  Submit date:2018/12/29